Hong Kong Science Park (Science Park Company) participated in the inaugural Future Industries Zone at the Hong Kong Autumn Electronics Fair on October 30, 2026, showcasing innovative achievements from Hong Kong's microelectronics ecosystem. The exhibition brought together five globally recognized microelectronics organizations, including the Hong Kong Microelectronics Research and Development Institute (MRDI), Laservall, CTGL, Intron Technology, and MassPhoton, highlighting cutting-edge technologies in semiconductor R&D, precision manufacturing, smart electronics, and optical communications.
Key Technologies on Display
CTGL showcased its smart energy ecosystem, particularly the "Vehicle-to-Grid" (V2G) bidirectional charging technology, which received a bronze award from the Hong Kong Electronics Industry Association (HKEIA). Additionally, CTGL presented smart devices and home energy management systems (HEMS) that support the Matter standard, enhancing the synergy between electric vehicles, smart homes, and energy assets to improve energy efficiency.
Intron Technology displayed a highly integrated board-level chip 3D vision sensing module designed for robots and autonomous vehicles, providing real-time depth mapping capabilities that surpass traditional sensing limitations. The company also showcased advanced embedded component packaging power modules with high thermal performance and power density, suitable for next-generation electric vehicle power systems.
Laservall presented its smart engineering platform, which integrates precision laser processing, automation, visual inspection, and artificial intelligence technologies, aimed at helping high-value manufacturing achieve micron-level precision, maintain quality consistency, and enhance production efficiency. The company's new product, XMLS (neXt-generation Micro Laser Soldering) technology, focuses on precision laser welding and fine solder ball welding for intricate connections.
Driving Future Industry Development
In addition to showcasing innovative technologies, the Science Park Company organized two thematic discussions focusing on the critical role of microelectronics in empowering industrial development and analyzing the process of technology from research to industrial application. The first discussion invited partners from the microelectronics industry and academia to explore how to translate research outcomes into industrial benefits; the second featured representatives from four park enterprises sharing insights on advanced manufacturing and global expansion.
The Science Park Company is committed to supporting enterprises in achieving transformation from "0 to 1" and "1 to N," establishing a comprehensive microelectronics ecosystem that gathers over 300 microelectronics companies and specialized R&D facilities, fostering collaboration among industry partners and research talent, and assisting enterprises in converting potential microelectronics innovations into high-value applications.
Startups' Breakthroughs
At the Future Industries Zone, startups nurtured by the Science Park Company, ExoTechHK Limited and EzyGreenPak, were selected as champions in the "CES Asia Unveiled Hong Kong Startup Pitch Competition," winning free exhibition space at the Eureka Park section of the 2027 Consumer Electronics Show (CES) in the United States. ExoTechHK's wearable robotic exoskeleton technology provides support for manual workers, reducing physical fatigue, while EzyGreenPak stood out with its plant fiber non-woven fabric technology that dissolves in hot water without producing microplastics.
This exhibition not only showcased Hong Kong's strength in the microelectronics field but also provided startups with the opportunity to present their innovative achievements to an international audience, opening up broader business opportunities.
Source: Hong Kong Science Park
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