NEPCON Japan will celebrate its 40th anniversary from January 21 to 23, 2026, at Tokyo Big Sight. The event will host over 200 seminars focusing on advancements in semiconductors, packaging, and electronics.
Rao Tummala, known as the “father of modern electronic packaging,” will present a session on the emergence of the Indian semiconductor industry. Other speakers include Ryutaro Yasuhara from TSMC and Tarek Ibrahim from Intel, who will discuss 3DIC technologies and advanced packaging.
The event will run alongside AUTOMOTIVE WORLD, Factory Innovation Week, and SMART LOGISTICS Expo, featuring a total of 1,850 exhibitors. Specialized sessions will cover topics such as electrification and autonomous driving, with contributions from companies like Toyota and Honda.
To facilitate international participation, an AI-powered translation system will be implemented for real-time language support during the conference sessions.
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